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Veins of water used to cool chips
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Veins of water used to cool chips

2008-06-10
Newsfeed

One of the world's biggest computing companies has developed a new way of cooling their latest computer chips using water.

One of the world's biggest computing companies has developed a new way of cooling their latest computer chips using water.

IBM believes the prototype technology, which involves using thousands of 'hair width' cooling arteries to counter the heat from the new 3D chips, could be used within five years.

The vertical layout of the chips means data has a shorter distance to travel - boosting PC performance. However, they also run significantly hotter than normal side-by-side chips.

Thomas Brunschwiler, of IBM's Zurich Research Laboratory, said: "As we package chips on top of each other we have found that conventional coolers attached to the back of a chip don't scale. "In order to exploit the potential of high-performance 3D chip stacking, we need interlayer cooling."

The researchers say even a small amounts of liquid flowing through the chips will see them run significantly cooler as water is more efficient than air at absorbing heat.

IBM now plans to use these new cooling structures for sophisticated chips.

Copyright © The Press Association 2008


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